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Products > Solder Products

Solderball

Composition Group

Size Spec.
Item Melting Tempe.(꼦) Specific Gravity
Lead-free Low Ag Sn-1Ag-0.1Cu 217 ~ 227 7.3
Sn -1Ag-0.5Cu 217 ~ 227 7.3
Sn -1.2Ag-0.5Cu-0.05Ni 217 ~ 227 7.4
Sn -1.2Ag-0.5Cu-0.05Sb 217 ~ 227 7.3
High Ag Sn-3Ag-0.5Cu 217 ~ 219 7.4
Sn-3Ag-0.5Cu + (0.01Ni + 0.01Ge) 217 ~ 219 7.4
Sn-3Ag-0.5Cu + (0.15In + 0.01Ge) 217 ~ 219 7.4
Sn-3.5Ag 221 7.3
Sn-4Ag-0.5Cu 217 ~ 219 7.4
LTS
(Low Temp. solder)
Sn-Ag-Bi-X 207 7.44

Solder Ball셲 composition may be adjusted upon receipt of customer셲 request.

Effect of each element in Sn-based alloy

Effect of each element in Sn-based alloy

Trend of Solder Ball Composition

Trend of Solder Ball Composition
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