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¿¬±¸°³¹ß > Capability
Wire Bonding & Test
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Bond Tester
Plasma Cleaning System
Solder Ball & Soldering Test
Reflow Machine
Zone Shear Tester
Wetting Balance Tester
High Speed Shear/Pull Tester
Reliability Test
HAST (Highly Accelerated Stress Test)
T/C Test (Temperature Cycle Test)
HTST (High Temperature Storage Test)
Micro-structure Analysis
FE-SEM
SEM & EDS
Metallurgical Microscope
Polishing System
Chemical Composition Analysis
ICP-OES
Spark Emission
Wet Analysis System
Oxygen Analysis System
Material Property Measurement System
High Temperature Tensile Strength Tester
Micro-Vickers Hardness Tester
Electrical Property Measuring System
DSC : Phase Change & Melting Temp. Check
Surface Analysis System
FIB (Focused Ion Beam) System
TEM (Transmission Electron Microscopy)
STEM (Scanning Transmission Electron Microscope)
AES (Auger Electron Spectroscope)
EPMA (Electron Probe Micro Analysis)
SIMS (Secondary Ion Mass Spectrometry)
TOC (Total Organic Carbon)
MKE
°æ±âµµ ¿ëÀνà óÀα¸ Æ÷°îÀ¾ ±Ý¾î¸® 316-2 / TEL : 031-330-1900 / FAX : 031-338-6817