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Top 10 ±Û·Î¹ú ¹ÝµµÃ¼ ±â¾÷°ú MKE °í°´

* MKE °í°´

¾÷ü ¼øÀ§ ¾È³»
¼øÀ§ Á¾ÇչݵµÃ¼ ¾÷ü Package ¾÷ü
1 Intel * ASE
2 * Samsung Electronics * Amko
3 * Texas Instruments * SPIL
4 * Toshiba * STATS ChipPAC
5 * Renesas Elecgtronics * Powertech
6 Qualcomm ChipMOS
7 * STMicroelectronics OSE
8 * Hynix ChipBond
9 * Micron Technology King Yuan
10 Broadcom * Great

(Source : Prismark 2012³â 3¿ù 'The Semiconductor and Packaging Report')

È®°íÇÑ Çѱ¹/´ë¸¸/Áß±¹/µ¿³²¾Æ °í°´ ±â¹Ý

Çѱ¹, ´ë¸¸, Áß±¹, µ¿³²¾Æ ½ÃÀåÀº Àüü ¹ÝµµÃ¼ Á¶¸³/°Ë»ç ½ÃÀåÀÇ 85% Á¡À¯

  • 2011³â ¿¬°£ °Å·¡ °í°´ ¼ö : 115
  • 2011³â ¿ùÆò±Õ °Å·¡ °í°´ ¼ö : 100
  • China/Hong Kong : SESS, TS LED, ASE, SPIL, SMIC, STM, Amkor, STATSChipPAC, PSTS, etc.
  • Korea : SEC, Samsung LED, Hynix, Amkor, STATSChipPAC, ASE, Signetics, Rohm, STS, Hana Micron, etc.
  • Japan : J-Device, Sanken, Toshiba, Mitsui-hitek, Renesas etc.
  • Taiwan : ASE, SPIL, Amkor, Greatek, PTI, Lingsen, Walton, etc.
  • Philippines : TI, Amkor, PSPC, Cypress, STM, etc.
  • SINGAPORE/MALAYSIA : STATSChipPAC Singapore, STATSChipPAC Malaysia, Freescale, Toshiba, Fairchild, STM, Spansion, etc.
  • THAILAND : Toshiba, Microchip, Millenim, Spansion, UTAC, etc.
  • MEXICO : Skyworks etc.
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